В276092/Vol. 2 Advances in electronic packaging 1993 [Text] : proceedings of the 1993 ASME International electronics packaging conference: presented at the ASME International packaging conference Binghamton, N.Y. September 29-October 2,1993 / ed. P. A. Engel, W. T. Chen ; American society of mechanical engineers. - New York, New York : United engineering center, 1993 . Vol. 2 : Thermal management solder technology optoelectronics packaging. - 1993. - p.XII, 551-1200. - (EEP ; vol.4-2). Дод. точки доступу: Engel, Peter A. \ed.\; Chen, William T. \ed.\; American society of mechanical engineers Видання зберігається у :